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Area-IO DRAM/logic integration with system-in-a-package (SiP)

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2 Author(s)
Anru Wang ; Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA ; Dai, W.

This paper presents a cost-effective area-IO DRAM (aDRAM)/logic integration implemented with CLC (chip-laminate-chip)-based system-in-a-package (SiP) technology. By inserting 512 area-IOs into the area-IO DRAM, the bandwidth of the area-IO DRAM can achieve 10GB/s when working under 166MHz. An interface module with configurable IO width was also developed to make this implementation platform able to be adapted by various applications. A performance analysis, including bandwidth and power is also presented in this paper. It is demonstrated that area-IO DRAM/logic integration with SiP technology provides significant cost-effective implementation methodology compared with embedded DRAM and off-chip DRAM.

Published in:

Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific  (Volume:2 )

Date of Conference:

18-21 Jan. 2005

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