By Topic

Ground bounce calculation due to simultaneous switching in deep sub-micron integrated circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
M. Hekmat ; Dept. of Electr. & Comput. Eng., British Columbia Univ., Canada ; Mirabbasi S ; M. Hashemi

Supply and ground variation due to switching noise is an important issue in digital and mixed-mode integrated circuits. An approach for calculating the supply and ground bounce is presented in which the effects of parasitic elements of package and bond wires are considered. The proposed method leads to a system of linear equations whose analytical solution can be used to predict the behavior of supply and ground variations. SPICE simulations are used to verify the accuracy of the approach. The importance of modeling package parasitics and the dependence of switching noise on parasitic elements are also discussed.

Published in:

2005 IEEE International Symposium on Circuits and Systems

Date of Conference:

23-26 May 2005