Cart (Loading....) | Create Account
Close category search window

Quantitative modelling and comparison of communication schemes to guarantee quality-of-service in networks-on-chip

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Harmanci, M.D. ; Processor Archit. & Mcroelectronic Syst. Labs., Swiss Fed. Inst. of Technol. Lausanne, Switzerland ; Escudero, N.P. ; Leblebici, Y. ; Ienne, P.

We address the quantitative comparison of two basic connection schemes for on-chip communication, connection-oriented and connection-less, regarding their enforcement of a defined quality of service for the communication. For such comparison, we have built similar models for the two approaches, whose simulation highlights the drawbacks and opportunities of each solution. We demonstrate that for variable bit-rate applications, the end-to-end delay for the individual flows is less stable in the connection-oriented scheme than in the connectionless scheme.

Published in:

Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on

Date of Conference:

23-26 May 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.