Close category search window
 

An integrated optical waveguide isolator based on multi mode interference by wafer direct bonding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Roh, J.W. ; Dept. of Material Sci. & Eng., Yonsei Univ., Seoul, South Korea ; Yang, J.S. ; Lee, S. ; Woo, D.H.
more authors

An integrated optical waveguide isolator by wafer direct bonding between the InGaAsP and Ce:YIG is reported. The layer structure of multi-mode section of the optical isolator is Ce:YIG/InGaAsP/InP. An external magnetic field is applied to the device to measure the optical isolation ratio. The isolation ratio was found to be 2.9 dB.

Published in:
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International

Date of Conference: 4-8 April 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.