Referenced Items are not available for this document.
A soot bonding method has been developed that solves the economic and limited-diameter problems associated with the conventional dielectrically isolated substrate. In this method, the Si-B-O soot particles used as adhesive agents are generated by essentially the same flame-hydrolysis technology used for fabricating optical waveguides. This soot bonding method is effective even for joining a surface with deep V-grooves or trenches, as well as for rough poly-Si-deposited surfaces. The ability to bond substrates with any joining surface conditions is expected to lead to wide application of this process and to a reduction of the steps, resulting in cost reduction
Published in:
Power Semiconductor Devices and ICs, 1991. ISPSD '91., Proceedings of the 3rd International Symposium on
Date of Conference: 22-24 Apr 1991
- Page(s):
- 203 - 208
- Meeting Date :
- 22 Apr 1991-24 Apr 1991
- ISSN :
- 1063-6854
- Print ISBN:
- 0-7803-0009-2
- INSPEC Accession Number:
- 4155065
- Conference Location :
- Baltimore, MD
- Digital Object Identifier :
- 10.1109/ISPSD.1991.146100
- Product Type:
- Conference Publications
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