Cart (Loading....) | Create Account
Close category search window

SWEAT structure design and test procedure criteria based upon TEARS characterization and spatial distribution of failures in iterated structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Crowell, C.R. ; Univ. of Southern California, Los Angeles, CA, USA ; Chih-Ching Shih ; Tyree, V.C.

The authors consider the prime issues that should be raised when one considers the design of a test system and the procedure to be involved in the test. An extended TEARS (Thermal Energy Accounts for the Resistance of the System) analysis yields end-to-end temperature profiles of an N-fold iterated SWEAT (Standard Wafer-level Electromigration Acceleration Test) structure. The results give guidelines for the choice of voltage probe locations and current injection line lengths and also permit relating measurements on SWEAT structures with different numbers of elemental units and different geometry. Asymmetries in the first and last units correlate with the observed spatial distribution of failures. Criteria for much more rapid convergence and more accurate control of sample stress are presented.<>

Published in:

Reliability Physics Symposium, 1991, 29th Annual Proceedings., International

Date of Conference:

9-11 April 1991

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.