By Topic

Novel technique of nickel disilicide formation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Singh, A. ; CEERI, Pilani, Rajasthan, India ; Khokle, W.S. ; Khokle, W.S.

This letter gives the first report of a novel technique of nickel disilicide formation by interaction of 1500 Å thick resistively heated tungsten filament evaporated nickel film with P-Si

Published in:

Proceedings of the IEEE  (Volume:75 ,  Issue: 6 )