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Modular assembly/packaging of multi-substrate microsystems (WIMS Cube) using thermo-magnetically actuated cables

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3 Author(s)
Ucok, A.B. ; Center for Wireless Integrated Microsystems, Michigan Univ., Ann Arbor, MI, USA ; Giachino, J.M. ; Najafi, K.

The authors report a packaging/assembly approach for wireless integrated microsystems (WIMS) using flexible thermo-magnetically actuated cables. In this assembly approach, substrates of a microsystem are stacked on top of one another inside a cube (WIMS cube). Electrical/fluidic signals are transferred between system dice using rows of integrated flexible parylene cables attached to cube walls, and actuated, row-by-row during assembly, to make pressure contacts to each die. Actuation of these cables is achieved using thermo-magnetic actuation; resistively generated heat softens up the parylene cable, and magnetic actuation plastically deforms the soft cable. Cubes with integrated parylene cables have been fabricated. Thermo-magnetically actuated 1mm × 1.3mm cables have been shown to deflect ∼800μm with two stable positions in a 0.1T magnetic field at a ∼90°C temperature achieved by resistive heating.

Published in:

Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on

Date of Conference:

30 Jan.-3 Feb. 2005

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