By Topic

SPICE simulation used to characterize the cross-talk reduction effect of additional tracks grounded with vias on printed circuit boards

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ladd, D.N. ; Dept. of Electr. Eng., Ottawa Univ., Ont., Canada ; Costache, G.I.

In analog and digital electronic systems, cross-talk between tracks on a printed circuit board can degrade the performance of equipment operations. A technique based on additional tracks grounded by vias, with which the cross-talk can be reduced by 50-90%, is presented. The circuit analysis code SPICE is used to analyze a lumped-circuit Tee structure model of three coupled lines. The via discontinuities are modeled in a novel way, which accounts for their transient skin-effect resistance. Both the cross-talk model and the cross-talk reduction technique are validated with measured results for signals of 50-1000 MHz, and risetimes of 5 ns. It is also shown how the far-field radiation from the circuit board is reduced with the introduction of additional grounded tracks

Published in:

Circuits and Systems II: Analog and Digital Signal Processing, IEEE Transactions on  (Volume:39 ,  Issue: 6 )