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Integration techniques suitable for microwave circuits have been developed. Various aspects of the technology of integration of microwave circuits are reviewed and the reasons for choosing the hybrid approach instead of the monolithic approach and thin-film metallization instead of thick-film are discussed. Design data relating circuit performance to substrate roughness and thickness of thin-film metal adhesion layers are presented. Propagation and radiation characteristics of microstrip lines are discussed. Design equations for thin-film lumped-element passive components are given. Exampies of various microwave integrated circuits are shown.