By Topic

Applications of integrated circuit technology to microwave frequencies

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Integration techniques suitable for microwave circuits have been developed. Various aspects of the technology of integration of microwave circuits are reviewed and the reasons for choosing the hybrid approach instead of the monolithic approach and thin-film metallization instead of thick-film are discussed. Design data relating circuit performance to substrate roughness and thickness of thin-film metal adhesion layers are presented. Propagation and radiation characteristics of microstrip lines are discussed. Design equations for thin-film lumped-element passive components are given. Exampies of various microwave integrated circuits are shown.

Published in:

Proceedings of the IEEE  (Volume:59 ,  Issue: 8 )