By Topic

Multilevel metal capacitance models for CAD design synthesis systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Jue-Hsien Chern ; Texas Instrum. Inc., Dallas, TX, USA ; Huang, J. ; Arledge, L. ; Li, P.-C.
more authors

An empirical model for multilevel interconnect capacitance is presented. This is the first model that allows designers to compute capacitances of arbitrary complex metal geometries. Such flexibility is achieved by a novel strategy of constructing complex geometries from simple primitive cells. Agreement with accurate simulations and measurements is within 8% over an extensive range of dimensions.<>

Published in:

Electron Device Letters, IEEE  (Volume:13 ,  Issue: 1 )