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Multilevel metal capacitance models for CAD design synthesis systems

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5 Author(s)
Jue-Hsien Chern ; Texas Instrum. Inc., Dallas, TX, USA ; Huang, J. ; Arledge, L. ; Li, P.-C.
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An empirical model for multilevel interconnect capacitance is presented. This is the first model that allows designers to compute capacitances of arbitrary complex metal geometries. Such flexibility is achieved by a novel strategy of constructing complex geometries from simple primitive cells. Agreement with accurate simulations and measurements is within 8% over an extensive range of dimensions.<>

Published in:

Electron Device Letters, IEEE  (Volume:13 ,  Issue: 1 )