Referenced Items are not available for this document.
The paper discusses the reliability test plan and test results on semiconductor network microelectronic devices. Included in the test plan are reliability programs, life testing, step stress testing, and environmental tests. The failure analysis-corrective action cycle is discussed at length. The failure analysis procedure is outlined with many specific examples of analysis results at various points in the analysis procedure.
Published in:
Proceedings of the IEEE
(Volume:52
,
Issue:
12
)
Date of Publication: Dec. 1964
- Page(s):
- 1624 - 1635
- ISSN :
- 0018-9219
- Digital Object Identifier :
- 10.1109/PROC.1964.3457
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 28 June 2005
- Issue Date :
- Dec. 1964
- Sponsored by :
- IEEE
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