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This paper describes the students' education in electronics packaging at Dresden University of Technology, Germany. Beginning with a summary about the general model and the existing lectures it is shown, how step by step the knowledge about the topics of producing electronic modules is improved and also combined with practical experiences and skills. Following this a brief section shows the recent developments in packaging. This leads to the necessity to enhance the courses contents to these leading-edge developments to well the students up for their upcoming business. Finally the concept of a course offered for graduate students and dealing with topics around nano-packaging is introduced.