By Topic

A new educational curriculum for microelectronic manufacturing engineering program

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Yang, D.G. ; Dept. of Mech. Eng., Guilin Univ. of Electron. Technol., China

Electronics manufacturing has become one of the major sectors in manufacturing industry. To meet the demands of the fast developing electronics industry, many well-qualified researchers and engineers are needed. A new interdisciplinary bachelor's program named as "microelectronics manufacturing engineering" was setup in 2003 in Guilin University of Electronic Technology (GUET). It is the first time that such a program is offered in China for undergraduates. Much effort is needed to improve the educational curriculum and educational means for the new specialization. This paper proposes an educational curriculum for microelectronic manufacturing engineering program. It explains the need for a formal undergraduate education of engineers in this discipline. The aim, objectives and scope of the educational curriculum is discussed. It is emphasized that the curriculum should cover the majors sectors of electronic manufacturing, with an emphasis on packaging, assembly and quality control. The curriculum structure and the main courses for the program are presented. The laboratory practices, factory practice and design projects related to the program are proposed.

Published in:

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Date of Conference:

31 May-3 June 2005