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The thermal conductivity of solder joint material with plastic core

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3 Author(s)
Hasegawa, A. ; Sekisui SOL Project High Performance Plastics Co., Sekisui Chem. Co., Ltd., Koga, Japan ; Okuda, M. ; Okinaga, N.

We have developed a solder joint material with a plastic core. In this paper, we report on the thermal conductivity of this material. We evaluated the thermal resistance θ j-a with 352pin EBGA and 352pin PBGA, and also carried out a thermal conductivity analysis using computer simulation. The result shows that the θ j-a of the 352pin EBGA was 12°C/W, θ j-a of the 352pin PBGA was 20°C/W. So this material is applicable for high frequency and power package (CPU, MCM, MCP, stacked package and so on).

Published in:

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Date of Conference:

31 May-3 June 2005

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