Cart (Loading....) | Create Account
Close category search window
 

Evaluation of gold and aluminum wire bond performance for high temperature (500 °C) silicon carbide (SiC) power modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Mustain, H.A. ; Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA ; Lostetter, A.B. ; Brown, W.D.

This paper describes an investigation of aluminum and gold wire bonding processes for high temperature electronics. Ultrasonic wire bonding of 8 and 15 mil aluminum wire and 3 mil gold wire on various metallized substrates was investigated. Aluminum wire bonds to nickel-plated aluminum nitride (AlN) and silicon nitride (SiN) substrates were thermally cycled between -55 °C and 400 °C, and gold wires bonded to gold-coated AlN and SiN substrates were thermally cycled between -55 °C and 500 °C. The thermal cycling was accomplished according to MIL-STD-883E criteria. An environmental scanning electron microscope (ESEM) was used to examine the wire/pad and pad/substrate interface areas before and after the thermal cycling. After thermal cycling, the samples were subjected to destructive pull testing at room temperature. The results of the testing revealed no significant degradation of the bonds after thermal cycling.

Published in:

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Date of Conference:

31 May-3 June 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.