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Portable electronic products such as cell phones are often subjected to drop tests to simulate consumer usage and to ensure required field reliability is met. Product-level drop tests can cause solder joint failures in both lead-free and tin-lead BGA packages due to the combination of highly localized strain created by high strain-rate mechanical shock. In order to understand this phenomenon at the package level, a 4-point dynamic bend test was developed to produce repeatable and scalable strain levels on printed circuit boards assembled with BGA packages deformed at high strain rates (surface strain rates >5/sec). This test method requires a very simple set up that can be easily replicated. Initial determination of board strain level at the point of BGA solder joint failure was characterized for lead-free (SnAgCu) BGA assemblies. This test, in conjunction with a Weibull failure model, provides a method to effectively evaluate BGA solder joint reliability in dynamic environments.