Cart (Loading....) | Create Account
Close category search window

Correlation between incubation time for edge drift and Pb migration in electromigration of eutectic SnPb lines

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Yoon, Min-Seung ; Sch. of Mater. Sci. & Eng., Seoul Nat. Univ., South Korea ; Shin-Bok Lee ; Min-Ky Ko ; Young-Bae Park
more authors

The smaller flip chip electronic packages are likely to have the higher current densities through their bumps, and this caused a failure due to electromigration at the eutectic SnPb solder bumps. In this study, we have analyzed the edge displacement with time and the relative Pb contents along the line as a result of the electromigration of eutectic SnPb using "edge drift" structures. It was of interest that an incubation stage for the edge drift was observed in the eutectic SnPb electromigration, i.e. there was a time duration before an edge began to move. The time duration for the incubation stage, and the drift velocity decreased in the smaller line length. It was observed that Pb became depleted at the cathode end while a pile-up of Pb was formed near the cathode end after the end of the incubation stage.

Published in:

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Date of Conference:

31 May-3 June 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.