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Passive assembly of single mode optoelectronic components is a prerequisite for some of the more advanced functional devices emerging in the marketplace. For example, in optical processing circuits (Cotter, 1995) it is essential to have serially cascaded active devices with time of flight control of the optical data. In such cases, the functionality cannot be achieved through any means other than hybrid integration of monolithic active chips with passive planar waveguides. This paper describes a high performance integration platform that can scale to high levels of monolithic chip integration on a hybrid waveguide motherboard which is suitable for these applications.