By Topic

Silicon optical benches for next generation optical packaging: going vertical or horizontal?

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Epitaux, M. ; Opt. platform Div., Intel Corp., Newark, CA, USA ; Petremand, Y. ; Noell, W. ; de Rooij, N.
more authors

In this paper, we present an alternative silicon bench approach using a vertical stacking method to improve upon the ubiquitous TO-can design. In the proposed design, the beam propagates vertically through several layers of micro-machined silicon pieces which perform substrate, RF feedthrough, hermetic sealing and optical alignment functions. Our packaging architecture includes a MEMS (micro-electro-mechanical system) actuation layer to actively align a lens to a single mode connector. Executed at the final assembly step, this MEMS alignment alleviates the need for expensive laser welding alignment stations.

Published in:

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Date of Conference:

31 May-3 June 2005