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An Applicatin of Micro-Ball Wafer Bumping to Double Ball Bump for Flip Chip Interconnection

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8 Author(s)
K. Tatsumi ; Adv. Technol. Res. Labs., Nippon Steel Corp., Chiba ; Y. Yamamoto ; K. Iwata ; E. Hashino
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Microball wafer bumping method was applied to forming double ball bumps, which increased the bump height to improve the reliability of the flip chip interconnection. The micro solder balls of 100mum in diameter were transferred and connected to the whole electrode-pads covered with UBMs (under bump metals) of an 8 inch wafer in one stroke using a fully automated micro ball mounter, which was originally developed. The balls were held on fluxed pads and melted in a reflow furnace. After cleaning the flux residue, the wafer bumped with microballs was then encapsulated with epoxy resin containing silica fillers by using Apic Yamada's wafer level molding system. The molding resin was spread to the whole wafer by compressing with a heated flat plate, where the top of the solder bumps were covered with an elastic parting film. The supplied resin volume was previously adjusted to the desired molding thickness. The exposed top of the ball bumps was cleaned and then second microball bumping was processed on the top of the first bumps. The first and second balls were connected by reflowing to form the double ball bumps. The height variation and shear strength of double ball bumps were evaluated. To compare the reliability for the different type of bumps the TCTs and FEM analysis were performed for the chips connected with PCBs

Published in:

Proceedings Electronic Components and Technology, 2005. ECTC '05.

Date of Conference:

May 31 2005-June 3 2005