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A recursive un-termination method for nondestructive in situ S-parameter measurement of hermetically encapsulated packages

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2 Author(s)
Pfeiffer, U.R. ; IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA ; Schuster, C.

In this paper, we analyze the performance of a newly introduced recursive un-termination method for nondestructive in situ S-parameter measurements of multiport packages. The fundamental limitations of the method are statistically analyzed and compared to conventional two-port probing techniques. The methodology is based on programmable terminations fully integrated in a standard silicon process technology (integrated-circuit chip) and a recursive un-terminating method implemented in software. To demonstrate the validity of the technique, results for a chip-on-board packaging technology have been compared to high-frequency electromagnetic simulations and direct two-port probing techniques.

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:53 ,  Issue: 6 )