Cart (Loading....) | Create Account
Close category search window
 

Iridium: an oxygen diffusion barrier and a conductive seed Layer for RABiTS-based coated conductors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Aytug, T. ; Dept. of Phys., Univ. of Tennessee, Knoxville, TN, USA ; Paranthaman, M. ; Zhai, H.Y. ; Leonard, K.J.
more authors

For power applications of YBa2Cu3O7-δ (YBCO) coated conductors, it is necessary to electrically stabilize the conductor. An economic way to achieve this, which also benefits the engineering JE, is to grow conductive buffer layers directly on textured Cu or Ni metal surfaces. However, due to poor oxidation resistance and high reactivity/diffusivity of Cu or Ni, an insulating oxide layer usually forms at the metal/substrate interface, degrading the electrical connectivity of the entire architecture. To overcome this problem, we have developed a new conductive, nonmagnetic buffer layer architecture of La0.7Sr0.3MnO3/Ir on textured Ni-based tapes. This structure serves as a barrier to both inward diffusion of oxygen and outward diffusion of metal cations. Using PLD to grow YBCO, we demonstrate ideal electrical coupling to the metal substrate. Critical current (Ic) values for 1 μm thick YBCO coatings exceed 100 A/cm-width at 77 K on a Ni-W RABiTS template.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:15 ,  Issue: 2 )

Date of Publication:

June 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.