By Topic

Progress in the preparation of technical HTS-tapes of type Bi-2223/Ag-alloy of industrial lengths

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Arndt, T.J. ; Eur. Adv. Supercond., Hanau, Germany ; Aubele, A. ; Krauth, H. ; Munz, M.
more authors

We report about the improvements on overall critical current density je, long-length processing, mechanical properties, and insulation. These topics are discussed for Bi-2223/Ag-alloy tapes for typical DC-applications, for AC-applications which require twisted filaments to achieve low-loss properties and for current-lead-applications (EAS is producing Bi-2223/AgMgAu-HTS-tapes for the CERN-LHC-Project). The state-of-the art production of Bi-2223/Ag-alloy tapes at EAS allows for overall current densities of >100 A/mm2. There is progress out of the development line to a value of more than 120 A/mm2, which will be transferred to the production line in the near future. Regarding AC-tapes with twisted filaments, it is possible to prepare tapes without a reduction in overall current density if the preparation parameters are kept within a well defined window. Both types of tapes are available in piece-lengths of up to 1500 m. The requirements on the piece-lengths of Bi-2223/AgMgAu-HTS-tapes for current leads are less stringent. This type of tape is available in piece-lengths up to 300 m with overall current densities up to 90 A/mm2.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:15 ,  Issue: 2 )