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Hybrid manufacturing - lower cost access to DSM technology

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2 Author(s)
Williams, B.N. ; Technol. Res. & Dev., AMI Semicond., Inc., Pocatello, ID ; Nelson, M.M.

The need for access to deep sub-micron (DSM) technology to supply cost effective designs to customers is offset by the high cost of entry. The hybrid manufacturing approach partially fabricates wafers in one facility and then completes the wafer fabrication in another facility, using compatible but different processes. There are significant cost benefits to using hybrid manufacturing for a deep submicron (DSM) offering. It provides lower non-recoverable expenses (NRE) as well as lower manufacturing costs per-wafer. Flexibility is increased for customers with smaller run rates. There are many technical challenges involved in making this hybrid process manufacturable and robust. These challenges have been solved in the implementation of our XPressArraytrade technology offering

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI

Date of Conference:

11-12 April 2005