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Chamber cleaning process selection for installed-base CVD tools

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5 Author(s)
Blundo, F. ; ST Microelectronics, Catania ; Alberghina, M. ; Frazzica, M. ; Loh, G.
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This study presents a c-C4F8 based chamber cleaning chemistry as an opportunity that has both process and ESH benefits with minimal cost and process modifications. c-C4F 8 was identified based on a balanced approach. The benefits of c-C4F8 compared to the C3F8 cleaning process were estimated to justify this work. Several factors related to cost and SHE were evaluated. Some issues pertaining to the cleaning gas delivery were considered. Previously optimized c-C 4F8 recipes were used to minimize the c-C4 F8 recipe development work. FTIR and optical emission endpoint detector were used to verify the completion of chamber cleaning, and the reductions in PFC emissions. The results indicated that the c-C4F8 cleaning process reduced PFC emission by 57%, compared to our current C3F8 cleaning process. Reduced gas consumption also enabled 20% cost saving on cleaning gas. This work demonstrated a low cost and low effort approach to reduce PFC emissions in installed-base tools

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI

Date of Conference:

11-12 April 2005