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Next generation manufacturing execution system (mes) enabling fully integrated fab automation in 300mm technology development and manufacturing

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1 Author(s)
Mouli, C. ; Logic Technol. Dev., Intel Corp., Hillsboro, OR

After a three year development and integration effort, Intel has successfully implemented a next generation MES system (referred to as MES300 henceforth this paper) in its state-of-the-art Technology Development fab DID, Oregon. MES300 provides integration of all MES functionality in an extensible framework based architecture, thereby enabling delivery of an active, fab event driven suite of capabilities. The new system provides flexibility in modeling and executing technology development in an automated fab operations environment, thereby delivering world-class information turns crucial for rapid process development. In addition, the new system enables fully automated fab operations for efficient high-volume manufacturing. MES300 is currently being simultaneously deployed in two other 300 mm high-volume manufacturing fabs as part of the 65 nm process technology transfer. This paper will include the following sections: (a) 300 mm automation drivers; (b) 300 mm technology and manufacturing requirements, legacy MES system deficiencies; (c) key elements of the next generation MES architecture implemented at Intel; (d) brief review of system design, development, test and deployment strategy; (e) sample of key capabilities delivered to date in DID/65 nm generation.; and (f) look-ahead on how MES300 is being leveraged to delivering industry leading automation capabilities in the next couple of year

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI

Date of Conference:

11-12 April 2005

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