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Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

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6 Author(s)
M. Kulawski ; VTT Microelectronics, Espoo ; H. Luoto ; K. Henttinen ; T. Suni
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In this work, an approach was made to use chemical mechanical polishing (CMP) by prototype fixed abrasive (FA) pads rather then conventional slurry based polishing for smoothing of bulk micro-machined and oxidized silicon wafers. A comparison is provided to conventional CMP, showing the minimization of edge rounding in case of FA use under the needed polishing step for sub-sequent wafer bonding. Simultaneously the achieved roughness provides a surface quality suitable for direct wafer bonding

Published in:

IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005.

Date of Conference:

11-12 April 2005