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CMOS has become a viable option for RF applications and system-on-chip. This paper reviews device modeling in predicting device behavior for RF IC applications. CMOS downsealing is discussed to examine the trend of device scaling and its impact to high frequency performance of devices. Some device behavior in advanced technology nodes is analyzed to be included in advanced device models. RF models to predict DC, AC noise and distortion behavior are desired while additional modeling efforts are required for parasitics such as interconnect and substrate.