By Topic

An overview of device modeling in bridging manufacturing and design for RF applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Yuhua Cheng ; Sky works Solutions Inc., Irvine, CA, USA

CMOS has become a viable option for RF applications and system-on-chip. This paper reviews device modeling in predicting device behavior for RF IC applications. CMOS downsealing is discussed to examine the trend of device scaling and its impact to high frequency performance of devices. Some device behavior in advanced technology nodes is analyzed to be included in advanced device models. RF models to predict DC, AC noise and distortion behavior are desired while additional modeling efforts are required for parasitics such as interconnect and substrate.

Published in:

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on  (Volume:2 )

Date of Conference:

18-21 Oct. 2004