Cart (Loading....) | Create Account
Close category search window

A novel method for in situ thermal expansion coefficient measurement of polysilicon thin films [MEMS materials applications]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yuxing Zhang ; Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China ; Qing-An Huang ; Weihua Li

This paper presents a novel structure for in situ determination of thermal expansion coefficient (TEC) of polysilicon thin films. Using this structure, all experiments are available in the air without any special requirements for vacuum or sealed chambers. Besides, a paramount novelty for this method is that all readouts are presented in electrical forms, compared with conventional ones obtained by optical observations. In the paper, a thermal-electro-mechanical compliant model is provided and verified with ANSYS software. Moreover, some optimized parameters are achieved through simulations, as well.

Published in:

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on  (Volume:3 )

Date of Conference:

18-21 Oct. 2004

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.