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Young's modulus characterization for the fragile low-k film by the improved surface acoustic waves technique

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4 Author(s)
Xia Xiao ; Sch. of Electron. & Inf. Eng., Tianjin Univ., China ; N. Hata ; Suying Yao ; T. Kikkawa

Low dielectric constant (k) materials applied for the ULSI interconnect insulator are required to meet the fast development of high-speed devices. Introducing nanopores into dielectrics reduces their k value effectively but also degrades the film hardness drastically. In this work, Young's moduli of several promising porous low-k films are determined by an improved technique of surface acoustic waves (SAWs). The twin-transducer is introduced to insure the propagation alignment of the laser generated SAWs, consequently increasing the accuracy of the measurement.

Published in:

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on  (Volume:1 )

Date of Conference:

18-21 Oct. 2004