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Low dielectric constant (k) materials applied for the ULSI interconnect insulator are required to meet the fast development of high-speed devices. Introducing nanopores into dielectrics reduces their k value effectively but also degrades the film hardness drastically. In this work, Young's moduli of several promising porous low-k films are determined by an improved technique of surface acoustic waves (SAWs). The twin-transducer is introduced to insure the propagation alignment of the laser generated SAWs, consequently increasing the accuracy of the measurement.
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on (Volume:1 )
Date of Conference: 18-21 Oct. 2004