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A beyond-1 GHz AMBA high-speed bus for SoC DSP platforms

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3 Author(s)
Landry, A. ; Concordia Univ., Montreal, Que., Canada ; Savaria, Y. ; Nekili, M.

This paper presents an on-chip interconnection infrastructure based on ARM's AHB standard to obtain a bus working beyond one gigahertz. All major design blocks necessary to implement reliable interconnect infrastructures for DSP platforms are presented. This interconnect infrastructure is implemented as a hard IP module to get the maximum performance out of TSMC's 0.18 μm CMOS technology. As a result, a bus operating at 1.4 GHz capable of transferring 2.8 giga data items per second was successfully designed.

Published in:

Microelectronics, 2004. ICM 2004 Proceedings. The 16th International Conference on

Date of Conference:

6-8 Dec. 2004