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A new unwinding machine is developed for a fine gold wire used in wire bonding machine for semiconductor assembly process. The tension of the fine gold wire should be kept constantly to avoid or reduce wire disconnection during the operation. A new relative motion control methodology of a following system to an independent leading system is applied to this machine to control the tension of the line. The unwinding machine developed in this research controls the tension of 2±0.1 g during unwinding the wire for a winding machine. The experimental results show the unwinding machine follows the independent motion of the winding machine keeping the tension requirement of 2±0.1 g.