Cart (Loading....) | Create Account
Close category search window

Determination of thermal compact model via evolutionary genetic optimization method

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Arunasalam, P. ; Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA ; Seetharamu, K.N. ; Azid, I.A.

Genetic Algorithms (GA) are adaptive search algorithms based on the theory of natural selection and survival of the fittest. In this study, GA was used to derive a thermal compact model of a micro lead frame package. The GA derived model was then used to compute the junction temperature (Tj) of the package for various boundary conditions. The results obtained were checked against simulation results of a detailed thermal model and were found to be within ±1.5% of error. Computational time taken by the detailed finite element model required approximately 4 min whereas the GA derived model took less than 35 s to generate the Tj of the package. Further, the study shows the feasibility and potential of applying GA as a powerful tool for optimization.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:28 ,  Issue: 2 )

Date of Publication:

June 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.