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The design and optimization methodology of a thermally conductive polyphenylene sulphide (PPS) polymer staggered pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described using existing analytical equations. The geometric dependence of heat dissipation and the relationships between the pin fin height, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. Experimental results of a pin finned thermally conductive PPS heat sink in natural convection indicate substantially high thermal performance. Numerical results substantiate analytical modeling results for heat sinks within the Aihara et al. fin density range. The cooling rates and coefficient of thermal performance, COPT, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks.
Components and Packaging Technologies, IEEE Transactions on (Volume:28 , Issue: 2 )
Date of Publication: June 2005