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To improve the electrical property of the isotropic conductive adhesives (ICA), self-assembled monolayer (SAM) compounds were used to help the dispersion of silver nanoparticles in epoxy resin. Silver nanoparticles were first treated by the SAM in order to increase the filler loading of nanoparticles in epoxy resin. The bonding and thermal debonding behavior between silver and SAM was investigated by differential scanning calorimeter (DSC). The amount of SAM coated on Ag nanoparticles was tested by thermogravimetric analysis (TGA). Scanning electron microscopy (SEM) was used to study the morphologies of SAM treated Ag nanoparticles before and after the heat treatment. Several kinds of epoxy formulation were prepared by using SAM-treated Ag nanoparticles as conductive fillers and the resistivities were studied.