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Molecular vapor deposition (MVD™) - a new method of applying moisture barriers for packaging applications

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4 Author(s)
Wanebo, M. ; Appl. MicroStructures, Inc., San Jose, CA, USA ; Kobrin, B. ; Helmrich, F. ; Chinn, J.

We propose that a composite hydrophobic SAM film with 100% coverage of all exposed surfaces can be used in many advance packaging applications. For example, a SAM moisture barrier with conventional plastic packaging could be a low cost alternative to hermetic ceramic housed devices and SAMs could be barriers to prevent moisture induced corrosion.

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on

Date of Conference:

16-18 March 2005