Referenced Items are not available for this document.
The RDL processing module provides an interconnect redistribution layer (RDL) used in flip chip packaging. The processing of this RDL module is explained in detail along with the design rules used RDL processing is shown to be very robust both structurally and electrically. This technique is compared with the industry to show the unique benefits of the AMIS methodology
Published in:
Microelectronics and Electron Devices, 2005. WMED '05. 2005 IEEE Workshop on
Date of Conference: 15-15 April 2005
- Page(s):
- 28 - 31
- Print ISBN:
- 0-7803-9072-5
- INSPEC Accession Number:
- 8487600
- Conference Location :
- Boise, ID
- Digital Object Identifier :
- 10.1109/WMED.2005.1431607
- Product Type:
- Conference Publications
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