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A systems perspective on digital interconnection technology

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6 Author(s)
Nordin, R.A. ; AT&T Bell Lab., Naperville, IL, USA ; Levi, A.F.J. ; Nottenburg, R.N. ; O'Gorman, J.
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The work describes, from a switching system designers perspective, present digital interconnection technologies and needs. The discussion begins at the chip-to-chip interconnection level and proceeds to the frame-to-frame level. The authors evaluate the optimal packaging and interconnection technology that should be used in future system designs. The analysis suggests that parallel optical data links based on a laser array technology implemented at the board-to-board level are presently advantageous. This analysis, as well as a detailed description of laser gate arrays, is also included

Published in:

Lightwave Technology, Journal of  (Volume:10 ,  Issue: 6 )

Date of Publication:

Jun 1992

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