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Coupling between differential signals and the dc power-bus in multilayer PCBs

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4 Author(s)
Chen Wang ; Nvidia Corp., Santa Clara, CA, USA ; Leone, M. ; Drewniak, J.L. ; Orlandi, A.

Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.

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Advanced Packaging, IEEE Transactions on  (Volume:28 ,  Issue: 2 )