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Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach

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2 Author(s)
Pfeiffer, U.R. ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; Chandrasekhar, A.

In this paper, the performance of flip-chip interconnects at frequencies up to 40 GHz is presented based on a nondestructive in situ measurement approach. The method unfolds the raw flip-chip interconnect excluding any launch structures in concomitance of a mounted silicon chip. The results are compared with a commonly used two-port through measurement technique of coplanar wave (CPW)-to-CPW transitions without involvement of a silicon chip. Finally, the attempt has been made to extract the electrical performance from a directly probed flip-chip interconnect for the first time.

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Advanced Packaging, IEEE Transactions on  (Volume:28 ,  Issue: 2 )