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The use of embedded solid-state heat extractors to increase the power densities in power electronic modules seems promising. Cross-sectional geometric optimization was done on heat extraction insert and it was found that the most suitable heat extraction configuration for the dimensional range applicable in power electronics is the use of flat continuous heat extraction layers aiding in conducting heat to externally mounted heat sinks. Theoretically expected thermal enhancement factors were determined and experimentally verified. The adverse influence of interfacial thermal resistances on the effectiveness of heat extraction inserts was also evaluated.