By Topic

K-band 3-D MMIC low noise amplifier and mixer using TFMS lines with ground slit

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Tokumitsu, T. ; Eudyna Devices Inc., Tokyo, Japan ; Piernas, B. ; Oya, A. ; Sakai, K.
more authors

Three-dimensional (3-D) microwave monolithic integrated circuit (MMIC) technology, that incorporates slits in the ground metal, was applied to K-band low noise amplifier (LNA) and I/Q mixer to provide a low cost solution for various K-band receivers such as for P-to-P radio, WLAN, and UWB sensors. The LNA incorporates a quasicoplanar stub in the input-matching network, improving the noise figure by 1 dB. This low-noise amplifier (LNA) exhibits a noise figure of 2.5 dB with an associated gain of 16 dB and an area of 0.75×0.65 mm2. The I/Q resistive mixer incorporates a broadside 3-dB coupler with a 22-μm-wide slit in the ground metal beneath the coupled thin-film micro-strip (TFMS) lines (patent pending). The insertion loss of the 3 dB coupler is 0.75 dB. The I/Q mixer exhibits a conversion loss of less than 14 dB at 0.1-2.0GHz IF frequencies for 2-dBm local input power. These LNA and mixer potentially make it easier to integrate receiver functions in a die.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:15 ,  Issue: 5 )