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Discussion with reply, of "Surface dielectric behavior of polymeric insulation under HV outdoor conditions" by R.S. Gorur and T. Orbeck

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1 Author(s)
Danikas, M.G. ; Segag AG, Malters, Switzerland

The commenter raises issues concerning the specific compositions of molding compounds not discussed in the original paper by R.S. Gorur and T. Orbeck (ibid., vol.26, no.5, p.1064-72, 1991). It is pointed out by Gorur and Orbeck that the questions raised by the commenter are based on detailed descriptions of materials given in some of the nine additional references listed in the discussion. Gorur and Orbeck state their belief that it is not possible or meaningful to readers to discuss these topics without prior knowledge of these references. They point out that their work was intended as a technical review of research and development work on surface dielectric behavior of polymeric insulation. It was focused on the dynamic nature of polymer surfaces and its effects on electrical behavior under HV stress.<>

Published in:

Electrical Insulation, IEEE Transactions on  (Volume:27 ,  Issue: 3 )

Date of Publication:

June 1992

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