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A novel quick thermal test method and mechanism for coolers and thermal modules

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2 Author(s)
Yi-Hsiang Cheng ; Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Wei-Keng Lin

This paper describes a quick thermal test method and an innovative mechanism that have been developed for measuring the thermal resistance of coolers and thermal modules. The test method basically relies on accurate measurement of the differential temperature of coolers/thermal modules at each time step. A theoretical analysis was also carried out in order to predict the steady-state temperature even though the test time is limited. We have validated this novel test method on a variety of coolers/thermal modules and the results show quite reliable comparing to the convectional test method. We also show the figures of this quick thermal test mechanism and explain its market trend in the future.

Published in:

Robotics and Automation, 2004. TExCRA '04. First IEEE Technical Exhibition Based Conference on

Date of Conference:

18-19 Nov. 2004