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The etch module is an important processing step in semiconductor device manufacturing. Due to the harsh environment in an etch chamber, in-situ monitoring of etch performance is extremely difficult. However, an intermediate variable such as wafer temperature provides an excellent alternative for in-situ etch performance monitoring. We discuss a wafer-level wireless sensor system along with advanced chamber diagnostic modeling techniques for in-situ etch process performance monitoring. The system is shown to be cost-effective, reliable, and easy to implement within any commercially available plasma chamber. In addition, a new level of process insight along with optimization opportunities can be realized from the system's implementation.