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Technological issues for micromachining of new passive THz-components based on deep-trench silicon etching

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3 Author(s)
Biber, S. ; Inst. for Microwave Technol., Erlangen-Nurnberg Univ., Erlangen, Germany ; Schur, J. ; Schmidt, L.P.

We present a survey of the application of micromachining techniques for the fabrication of THz-components. Micro-machining of new THz- devices based on deep trench etching of silicon is discussed with respect to its capability to generate complex 3-dimensional geometries with high aspect ratios (ARs) and to meet the high mechanical requirements for THz-components. First results for the application of deep trench etching for the design of a branch-line coupler for 600 GHz is discussed. We emphasize the potential of silicon based microstructures for manufacturing new devices and focus on technological issues.

Published in:

Infrared and Millimeter Waves, 2004 and 12th International Conference on Terahertz Electronics, 2004. Conference Digest of the 2004 Joint 29th International Conference on

Date of Conference:

27 Sept.-1 Oct. 2004