Referenced Items are not available for this document.
A novel approach is proposed for generating compact dynamic thermal models of packages, independent of boundary conditions. This approach is based on the novel definition of Robin's boundary condition independent dynamic thermal network and on the application of a novel multivariate moment matching method. The resulting compact thermal models are more accurate than compact models obtained by means of previous methods.
Published in:
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Date of Conference: 15-17 March 2005
- Page(s):
- 175 - 181
- ISSN :
- 1065-2221
- Print ISBN:
- 0-7803-8985-9
- INSPEC Accession Number:
- 8402973
- Digital Object Identifier :
- 10.1109/STHERM.2005.1412175
- Product Type:
- Conference Publications
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