By Topic

Physical design of optoelectronic system-on-a-package: a CAD tool and algorithms

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chung-Seok Seo ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Chatterjee, A. ; Jokerst, N.M.

We propose a new approach to the physical design of optoelectronic system-on-a-package (SOP) using optical waveguide interconnect technology. The objective is to improve the performance of SOP by replacing long distance electrical interconnects with optical waveguide interconnects. A new simultaneous optimization algorithm for module placement and routing of electrical and optical interconnects is introduced. It not only improves the performance of SOP, but reduces the simulation time. Even though a small portion of electrical interconnects are replaced with optical interconnects, more than 21% improvement of the SOP performance is achieved.

Published in:

Quality of Electronic Design, 2005. ISQED 2005. Sixth International Symposium on

Date of Conference:

21-23 March 2005